APAC Innovation Summit, 2-3 June 2016


When: 2-3 June 2016
Where: Grand Hall, Phase 3, Science Park


DAY 1 (2 JUNE 2016 09:30 - 17:30)

Main Conference

Featuring keynote speakers from both industry and research community, this will be a forward-looking sharing session which identifies new challenges and trends of robotics

DAY 2 (3 JUNE 2016 09:30 - 12:30)

Industrial Automation
Assistive/Home Care & Edutainment

DAY 2 (3 JUNE 2016 14:00 - 17:30)

Industrial Automation
Medical Use

French Speaker:

Jean-Pierre Talpin , INRIA (French National Institute for Research in Computer Science and Automation)

Title: Architecture-Centric Design and Analysis of CPS
When: 3 JUNE 2016 at 10:10 am


Connect Collaborate Catalyse

With an aim to provide an exchange platform on the trend of specific technology sectors and ready-for-market innovations, APAC Innovation Summit (“AIS” in short and formerly known as InnoAsia) will adopt a thematic approach covering the following major technology areas with a series of events spreading over the year at Hong Kong Science Park:

Riding on the success of the past 11 years, this flagship event of Hong Kong Science and Technology Parks Corporation continues to play an important role in knowledge transfer and business matching, bringing together a world cast of leading experts including academia, decision makers and thought leaders to exchange insights on the latest technology trends. With a total attendance of over 2,000 local and overseas executives in 2015 as well as the support from 122 globally renowned speakers and more than 120 partners from universities, R&D centres, media agencies and industry associations, this annual event has established an international reputation.

publié le 25/05/2016

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